Product Overview

The A33002 is a 360 contactless angle sensor IC utilizing Circular Vertical Hall (CVH) technology to provide high-resolution angular position data. Its System-on-Chip (SoC) architecture integrates a CVH front end, digital signal processing for angle calculation, and selectable output protocols (SPI, SENT, or PWM). Featuring on-chip EEPROM for flexible programming of calibration parameters (up to 100 read/write cycles), the A33002 is designed for automotive applications such as electronic power steering (EPS), transmission actuators, and BLDC pumps, requiring precise 0 to 360 angle measurements. It includes 32-segment linearization for improved accuracy, compensating for magnet-to-sensor misalignment and magnetization imperfections. The device supports integration into safety-critical applications, with single-die versions targeting ASIL B and dual-die versions targeting ASIL D compliance when used with appropriate system-level controls as detailed in the A33002 Safety Manual.

Product Attributes

• Brand: Allegro MicroSystems
• Technology: Circular Vertical Hall (CVH)
• Architecture: System-on-Chip (SoC)
• Safety Compliance: Supports ISO 26262 requirements; Single-die version designed to meet ASIL B; Dual-die version designed to meet ASIL D
• Package: 14-pin TSSOP (Suffix LE)
• Lead Finish: 100% matte tin leadframe plating
• Certifications: SAE J2716 JAN2010-compliant (SENT output)

Technical Specifications

Characteristic	Symbol	Test Conditions	Min.	Typ.	Max.	Unit
Supply Voltage	VCC	Customer supply	3.7		5.5	V
Supply Current	ICC	Each die	11	13	16	mA
Operating Temperature Range	TA		40		150	C
Maximum Junction Temperature	TJ(max)				165	C
SPI Clock Frequency	fSCLK	VOUT, CL = 20 pF	0.1		10	MHz
SENT Tick Time	tTICK	All SENT Modes	0.5		7.9375	s
Angle Error (25C, ideal alignment)	ERRANG	TA = 25C, ideal magnet alignment, B = 300 G, target rpm = 0	1.2	0.4	1.2	degrees
Angle Error (150C, ideal alignment)	ERRANG	TA = 150C, ideal magnet alignment, B = 300 G, target rpm = 0	1.5	0.5	1.5	degrees
Effective Resolution		B = 300 G, TA = 25C		12.5		bits
Package Thermal Resistance	RJA	LE-14 package; measured on JEDEC JESD51-7 2s2p board		82		C/W
Model	A33002LLEATR	Single Die, 3.3 V, 14-pin TSSOP
Model	A33002LLEBTR-DD	Dual Die, 3.3 V, 14-pin TSSOP
Model	A33002LLEATR-5	Single Die, 5.0 V, 14-pin TSSOP

2401241356_ALLEGRO-A33002LLEATR_C3716194.pdf